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South Korea launches a $576 billion AI-chip and semiconductor capacity drive

South Korea discusses accelerated semiconductor capacity investment with Samsung and SK Hynix

SK Telecom plans AI data-centre capacity of up to 15 GW

ASML capacity plan highlights the physical bottleneck behind AI demand

Micron backs domestic silicon-wafer capacity with financing and a ten-year agreement

Micron breaks ground on ¥1.5 trillion Hiroshima HBM expansion

South Korean groups commit $195 billion to AI, robotics and advanced manufacturing

NVIDIA-backed factory upgrade expands AI-component manufacturing in Texas

AI hardware demand redraws Asian air-cargo routes toward Malaysia, Vietnam and Singapore

China’s factory recovery is increasingly concentrated in AI-related exports

Qualcomm explores custom chip-design services for ByteDance

EU joins Pax Silica initiative for AI and chip supply-chain security

Solstice to acquire Element Solutions in $14.5B AI supply-chain materials deal

EU Joins Pax Silica to Reduce Dependence on Chinese AI Supply Chains

FICG links Johor manufacturing with Singapore sourcing and innovation through a JS-SEZ strategy

Standard Motor Products forms Thailand sensor-manufacturing joint venture

Senior Director, Supply Planning — Networking Products

EVENT: ISS Japan concludes with economic-security and semiconductor-resilience sessions

EVENT: TSMC releases June monthly sales

SHORTAGE: Sonix warns memory constraints could affect imaging shipments through 2026

Semiconductor security policy needs dependency-level capacity models

The semiconductor supercycle creates allocation decisions beyond the chipmakers

Semiconductor revenue signals must be separated from usable capacity

AI chip demand must be planned through tool capacity, not headline demand

Long-term semiconductor agreements shift risk upstream to yield and qualification

STMicroelectronics: AI infrastructure demand is reshaping semiconductor capacity allocation

AI infrastructure growth depends on physical logistics capacity

HBM supply is a qualification and packaging problem, not only a fab-capacity problem

South Korea’s AI investment wave will expose shared physical bottlenecks

Chipflation is becoming a cross-industry planning constraint

George Cooper